South Korean memory chip giant SK Hynix will produce sixth-generation high-bandwidth memory (HBM4) chips using TSMC’s 3nm process for key clients in the second half of 2025,Erotic movies online The Korea Economic Daily reported on Tuesday. Sources indicate that SK Hynix will partner with TSMC to release a prototype of vertically stacked HBM4 chips with a base die manufactured using TSMC’s 3nm process as early as March next year. NVIDIA will be the primary customer for the shipments. A base die refers to the foundational layer in a multi-layer semiconductor package, particularly in advanced memory chips such as HBM. Having HBM stacked on a 3nm base die is expected to boost performance by 20-30% compared to HBM4 with a 5nm base die, the report added. [The Korea Economic Daily]
(Editor: {typename type="name"/})
The Budget and the Political Imagination Deficit
Darren Aronofsky explains his new movie, 'mother!'
Why deleting terrorist content within 2 hours off social networks isn't the solution we need
Your Google Home will now help you find dates
Paying for antivirus software is mostly BS
Please enjoy Arya and Brienne training for their 'Game of Thrones' fight like badasses
Here’s what your identity sells for on the dark web
I Still Know What You Did Last Summer
Hurricane Maria may be Puerto Rico’s most destructive storm, period
接受PR>=1、BR>=1,流量相当,内容相关类链接。